In Stock: 0
| Quantity | Price |
|---|---|
| 1+ | $0.00 |
| 10+ | $0.00 |
| 100+ | $0.00 |
| 1000+ | $0.00 |
| 10000+ | $0.00 |
*All prices are for reference only. No order is accepted without a hard copy quote.
Manufacturer Part No: BR100/03,113
Manufacturer: NXP SEMICONDUCTORS
Category: DIAC
Description: 36 V, DIAC, DO-35
Package Description: HERMETIC SEALED, GLASS PACKAGE-2
NXP SEMICONDUCTORS BR100/03,113 technical specifications and attributes
HTSUS
8541.30.0080
SERIES
OPERATING TEMPERATURE
100°C (TJ)
SUPPLIER DEVICE PACKAGE
ALF2
PACKAGING
Tape & Reel (TR) Cut Tape (CT)
ECCN
EAR99
CATEGORY
DIACs, SIDACs
BASE PRODUCT NUMBER
BR10
MOISTURE SENSITIVITY LEVEL MSL
1 (Unlimited)
ROHS STATUS
ROHS3 Compliant
PACKAGE CASE
DO-204AH, DO-35, Axial
PART STATUS
Obsolete